近藤研究室
Publications
Supercritical carbon dioxide etching of transition metal (Cu, Ni, Co, Fe) thin films
Md Rasadujjaman, Yoshiki Nakamura, Mitsuhiro Watanabe, Eiichi Kondoh, Mikhail R. Baklanov
Microelectronic Engineering, 153, (2016), 5−10.
DOI: 10.1016/j.mee.2015.12.018
Supercritical CO2 reactor for wafer-scale thin film deposition: reactor concept, numerical results, and Cu deposition
Eiichi Kondoh, Takahiro Ueno, Shuhei Kurita, Mitsuhiro Watanabe, Satoshi Yamamoto, Tatsuo Suemasu
The Journal of Supercritical Fluids, 104, (2015), 49−53.
DOI: 10.1016/j.supflu.2015.05.021
Supercritical fluid chemical deposition of Cu in Ru and TiN-lined deep nanotrenches using a new Cu(I) amidinate precursor
Md Rasadujjaman, Mitsuhiro Watanabe, Hiroshi Sudoh, Hideaki Machida, Eiichi Kondoh
Microelectronic Engineering, 137, (2015), 32−36.
DOI: 10.1016/j.mee.2014.11.021
Selective Cu filling of nanopores using supercritical carbon dioxide
Eiichi Kondoh, Yukihiro Tamegai, Mitsuhiro Watanabe, Lianhua Jin
Japanese Journal of Applied Physics, 54, (2015), 05EA02.
DOI: 10.7567/JJAP.54.05EA02
Agglomeration and diffusion in Cu thin films under supercritical CO2 annealing
Yoshiki Nakamura, Mitsuhiro Watanabe, Eiichi Kondoh
Japanese Journal of Applied Physics, 54, (2015), 05EA03.
DOI: 10.7567/JJAP.54.05EA03
Formation of zinc oxide thin film using supercritical fluids and its application in fabricating a reliable Cu/glass stack
Mitsuhiro Watanabe, Shigeaki Tamekuni, Eiichi Kondoh
Microelectronic Engineering, 141, (2015), 184−187.
DOI: 10.1016/j.mee.2015.03.031
Fabrication of a Cu/Ni stack in supercritical carbon dioxide at low-temperature
Md Rasadujjaman, Mitsuhiro Watanabe, Hiroshi Sudoh, Hideaki Machida, Eiichi Kondoh
Thin Solid Films, 591, (2015), 13−17.
DOI: 10.1016/j.tsf.2015.08.011
塗布法によって堆積したZnO薄膜を用いたCu/ガラス構造の密着性向上ならびにその形成条件の検討
渡邉満洋, 小池光海, 近藤英一
表面技術, 66, (2015), 534−539.
DOI: 10.4139/sfj.66.534
Polarization characteristics of scattered light from macroscopically rough surfaces
Lianhua Jin, Koji Yamaguchi, Mitsuhiro Watanabe, Shinichiro Hira, Eiichi Kondoh, Bernard Gelloz
Optical Review, 22, (2015), 511−520.
DOI: 10.1007/s10043-015-0117-2
Dispersion measurement of the electro-optic coefficient r22 of the LiNbO3 crystal with Mueller matrix spectropolarimetry
Lianhua Jin, Kouhei Nara, Kuniharu Takizawa, Eiichi Kondoh
Japanese Journal of Applied Physics, 54, (2015), 078003.
DOI: 10.7567/JJAP.54.078003
Correction of large retardation window effect for ellipsometry measurements using quasi-Newton method
Lianhua Jin, Syouki Kasuga, Eiichi Kondoh, Bernard Gelloz
Applied Optics, 54, (2015), 2991−2998.
Cu coating inside small (15µm) and ultrahigh-aspect-ratio (>130) through-holes using supercritical CO2 fluid
Mitsuhiro Watanabe, Yuto Takeuchi, Takahiro Ueno, Eiichi Kondoh, Satoshi Yamamoto, Naohiro Kikukawa, Tatsuo Suemasu
Japanese Journal of Applied Physics, 53, (2014), 05GA08.
DOI: 10.7567/JJAP.53.05GA08
Room-temperature intermixing for adhesion enhancement of Cu/SiO2 interface by adopting SiO2 surface dope and noble metal catalyzation
Mitsuhiro Watanabe, Akira Teraoka, Eiichi Kondoh
Japanese Journal of Applied Physics, 53, (2014), 05GA02.
DOI: 10.7567/JJAP.53.05GA02
Improvement of adhesion and interfacial diffusion behavior in Cu/glass structures using OsOx layers for microelectromechanical systems
Mitsuhiro Watanabe, Eiichi Kondoh
Microelectronic Engineering, 120, (2014), 59−66.
DOI: 10.1016/j.mee.2013.09.008
Codeposition of Cu/Ni thin films from mixed precursors in supercritical carbon dioxide solutions
Md Rasadujjaman, Mitsuhiro Watanabe, Eiichi Kondoh
Japanese Journal of Applied Physics, 53, (2014), 05GA07.
DOI: 10.7567/JJAP.53.05GA07
In situ observation of Pt deposition process by using spectroscopic ellipsometry
Toshiaki Goto, Mitsuhiro Watanabe, Lianhua Jin, Eiichi Kondoh
Microelectronic Engineering, 121, (2014), 39−41.
DOI: 10.1016/j.mee.2014.03.001
Nanohole Coat/Fill with Pt via Chemical Deposition in Supercritical Fluids
Eiichi Kondoh, Toshiaki Goto, Mitsuhiro Watanabe
Key Engineering Materials, 617, (2014), 184−186.
DOI: 10.4028/www.scientific.net/KEM.617.184
Copper deposition in microporous silicon using supercritical fluid
Lianhua Jin, Toshifumi Oya, Shigeaki Tamekuni, Mitsuhiro Watanabe, Eiichi Kondoh, Bernard Gelloz
Thin Solid Films, 567, (2014), 82−86.
DOI: 10.1016/j.tsf.2014.07.042
Nickel filling in nanofeatures using supercritical fluid and its application to fabricating a novel catalyst structure for continuous growth of nanocarbon fibers
Mitsuhiro Watanabe, Kazuma Osada, Eiichi Kondoh, Soichiro Okubo, Takeshi Hikata, Akira Nakayama
APL Materials, 2, (2014), 100701.
DOI: 10.1063/1.4897962
General window correction method for ellipsometry measurements
Lianhua Jin, Syouki Kasuga, Eiichi Kondoh
Optics Express, 22, (2014), 27811−27820.
DOI: 10.1364/OE.22027811
Design of a Multi-Wafer Reactor for Supercritical Fluid Deposition of Cu in Mass Production: (1) Mechanism and Kinetics
Takeshi Momose, Masakazu Sugiyama, Eiichi Kondoh, Yukihiro Shimogaki
Journal of Chemical Engineering of Japan, 47, (2014), 737−742.
DOI: 10.1252/jcej.13we225
Design of a Multi-Wafer Reactor for Supercritical Fluid Deposition of Cu in Mass Production: (2) Benchmarks for Single- and Multiple-Wafer Reactors
Takeshi Momose, Masakazu Sugiyama, Eiichi Kondoh, Yukihiro Shimogaki
Journal of Chemical Engineering of Japan, 47, (2014), 743−749.
DOI: 10.1252/jcej.13we274
Correction of large birefringent effect of windows for in situ ellipsometry
Lianhua Jin, Eiichi Kondoh
Optics Letters, 39, (2014), 1549−1552.
DOI: 10.1364/OL.39.001549
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Room-Temperature Formation of a ZnO-Based Adhesion Layer for Nanoprecision Cu/Glass Metallization
Akira Teraoka, Mitsuhiro Watanabe, Yoichi Nabetani, Eiichi Kondoh
Japanese Journal of Applied Physics, 52, (2013), 05FB04.
DOI: 10.7567/JJAP.52.05FB04
Adhesion Strength and Microstructure of Cu/Ni/OsOx/glass Structure for Highly-Reliable Cu Interconnection
Mitsuhiro Watanabe, Eiichi Kondoh
Materials Research Society proceedings, 1559, (2013).
DOI: 10.1557/opl.2013.849
Synthesis of Platinum-Ruthenium Alloy Nanoparticles on Carbon Using Supercritical Fluid Deposition
Mitsuhiro Watanabe, Tatsunori Akimoto, Eiichi Kondoh
ECS Journal of Solid State Science and Technology, 2, (2013), M9−M12.
DOI: 10.1149/2.020301jss
超臨界流体を利用した生体組織のメタライズ
近藤英一, 望月裕文, 渡邉満洋
表面技術, 64, (2013), 467−468.
DOI: 10.4139/sfj.64.467
Supercritical fluid deposition of copper into mesoporous silicon
Lianhua Jin, Eiichi Kondoh, Toshifumi Oya, Bernard Gelloz
Thin Solid Films, 545, (2013), 357−360.
DOI: 10.1016/j.tsf.2013.08.034
Fast Imaging Ellipsometry Using a LiNbO3 Electrooptic Crystal
Lianhua Jin, Riyouma Yagi, Kuniharu Takizawa, Eiichi Kondoh
Japanese Journal of Applied Physics, 52, (2013), 036702.
DOI: 10.7567/JJAP.52.036702
One-Step Fabrication of Copper Thin Films on Insulators Using Supercritical Fluid Deposition
Takeshi Uejima, Takeshi Momose, Masakazu Sugiyama, Eiichi Kondoh, Yukihiro Shimogaki
Journal of The Electrochemical Society, 160, (2013), D3290−D3294.
DOI: 10.1149/2.044312jes
自己集積化ナノリソグラフィを利用したSiナノホールアレイ形成とCu埋め込み
近藤英一, 玉井架, 松村道雄
表面技術, 64, (2013), 659−661.
DOI: 10.4139/sfj.64.659
Conformal Copper Coating of True Three-Dimensional Through-Holes Using Supercritical Carbon Dioxide
Mitsuhiro Watanabe, Yuto Takeuchi, Takahiro Ueno, Masahiro Matsubara, Eiichi Kondoh, Satoshi Yamamoto, Naohiro Kikukawa, Tatsuo Suemasu
Japanese Journal of Applied Physics, 51, (2012), 05EA01.
DOI: 10.1143/JJAP.51.05EA01
In-situ Spectroscopic Ellipsometry of Cu Deposition Process from Supercritical Fluids: Evidence of an Abnormal Surface Layer Formation
Takuya Sasaki, Yukihiro Tamegai, Takahiro Ueno, Mitsuhiro Watanabe, Lianhua Jin, Eiichi Kondoh
Japanese Journal of Applied Physics, 51, (2012), 05EA02.
DOI: 10.1143/JJAP.51.05EA02
超臨界CO2中堆積法を利用した活性炭表面へのPtナノ粒子担持
秋本竜昇, 渡邉満洋, 近藤英一
表面技術, 63, 6, (2012), 365−368.
DOI: 10.4139/sfj.63.365
Effects of surface modification of carbon nanotube on platinum nanoparticle deposition using supercritical carbon dioxide fluid
Mitsuhiro Watanabe, Tatsunori Akimoto, Eiichi Kondoh
Physica Status Solidi A, 209, (2012), 2514−2520.
DOI: 10.1002/pssa.201228305
Birefringence Polarimeter Using Dual LiNbO3 Electrooptic Crystal Modulators
Takeshi Saitou, Muhammad Nurdin Bin, Hiroyuki Kowa, Norihiro Umeda, Kuniharu Takizawa, Eiichi Kondoh, Lianhua Jin
Japanese Journal of Applied Physics, 51, (2012), 082201.
DOI: 10.1143/JJAP.51.082201
Resonance Properties of Surface Acoustic Wave Resonator in Supercritical CO2
Shoji Kakio, Katsuhiro Hayashi, Eiichi Kondoh
Japanese Journal of Applied Physics, 51, (2012), 07GC18.
DOI: 10.1143/JJAP.51.07GC18
Behavior of Surface Acoustic Wave Resonators in Supercritical CO2
Shoji Kakio, Katsuhiro Hayashi, Eiichi Kondoh, Yasuhiko Nakagawa
Japanese Journal of Applied Physics, 50, (2011), 07HD08.
DOI: 10.1143/JJAP.50.07HD08
In situ ellipsometry of porous low-dielectric constant films in supercritical carbon dioxide
Eiichi Kondoh, Shosaku Aruga
Microelectronic Engineering, 88, (2011), 623−626.
DOI: 10.1016/j.mee.2010.05.008
Initial Cu Growth in Cu-Seeded and Ru-Lined Narrow Trenches for Supercritical Fluid Cu Chemical Deposition
Eiichi Kondoh, Masahiro Matsubara, Kakeru Tamai, Yukihiro Shimogaki
Japanese Journal of Applied Physics, 49, (2010), 05FA07.
DOI: 10.1143/JJAP.49.05FA07
Step Coverage Quality of Cu Films by Supercritical Fluid Deposition Compared with Chemical Vapor Deposition
Takeshi Momose, Masakazu Sugiyama, Eiichi Kondoh, Yukihiro Shimogaki
Japanese Journal of Applied Physics, 49, (2010), 05FF01.
DOI: 10.1143/JJAP.49.05FF01
Kinetics of Deposition of Cu Thin Films in Supercritical Carbon Dioxide Solutions from a F-Free Copper(II) b-Diketone Complex
Masahiro Matsubara, Michiru Hirose, Kakeru Tamai, Yukihiro Shimogaki, Eiichi Kondoh
Journal of Electrochemical Society, 156, (2009), H443−H447.
DOI: 10.1149/1.3110918
Topography-sensitive copper deposition in supercritical solutions
E. Kondoh, K. Nagano, C. Yamamoto, J. Yamanaka
Microelectronic Engineering, 86, (2009), 902−905.
DOI: 10.1016/j.mee.2009.01.084
Copper Deposition Technology for Thru Silicon Via Formation Using Supercritical Carbon Dioxide Fluids Using a Flow Type Reaction System
Masahiro Matsubara, Eiichi Kondoh
Materials Research Society proceedings, 1156, (2009).
DOI: 10.1557/PROC-1156-D08-07-F06-07
3次元集積回路電極用Siマイクロ孔内側壁に超臨界流体を利用してCuを堆積した際の被覆特性の検討
松原正弘, 近藤英一
表面技術, 60, (2009), 533−539.
DOI: 10.4139/sfj.60.533
超臨界流体を用いたCu薄膜の作製と半導体素子の配線・実装応用
近藤英一, 松原正弘
Journal of the Vacuum Society of Japan, 52, (2009), 544−549.
DOI: 10.3131/jvsj2.52.544
Deposition kinetics and narrow-gap-filling in Cu thin film growth from supercritical carbon dioxide fluids
Eiichi Kondoh, Junpei Fukuda
The Journal of Supercritical Fluids, 44, (2008), 466−474.
DOI: 10.1016/j.supflu.2007.12.004
Condensation and cleaning of an organometallic copper compound to/from porous low-dielectric constant thin films in supercritical carbon dioxide
E. Kondoh, E. Ukai, S. Aruga
Physica Status Solidi C, 5, (2008), 1219−1222.
DOI: 10.1002/pssc.200777844
Deposition of Zinc Oxide Thin Films in Supercritical Carbon Dioxide Solutions
Eiichi Kondoh, Kenji Sasaki, Yoichi Nabetani
Applied Physics Express, 1, (2008), 061201.
DOI: 10.1143/APEX.1.061201
Conformal Deposition and Gap-Filling of Copper into Ultranarrow Patterns by Supercritical Fluid Deposition
Takeshi Momose, Masakazu Sugiyama, Eiichi Kondoh, Yukihiro Shimogaki
Applied Physics Express, 1, (2008), 097002.
DOI: 10.1143/APEX.1.097002
Reduction of thin oxidized copper films using a hot-filament hydrogen radical source
E. Kondoh, M. Fukasawa, T. Ojimi
Journal of Vacuum Science & Technology A, 25, (2007), 415−420.
DOI: 10.1116/1.2712197
Novel [Topography-Sensitive] Bottom-Up Growth of Ruthenium and Copper for Filling Nano-Features Using Supercritical CO2 Fluids: Beyond Scalability
E. Kondoh, M. Hirose, E. Ukai, K. Nagano
Materials Research Society proceedings, 992, (2007).
DOI: 10.1557/PROC-0992-D02-03
超臨界流体を利用した薄膜形成技術
近藤英一
表面技術, 57, (2006), 695−700.
DOI: 10.4139/sfj.57.695
Deposition of Cu thin films from supercritical carbon dioxide using hexafluoroacetylacetnatecopper
E. Kondoh, K. Shigama
Thin Solid Films, 491, (2005), 228−234.
DOI: 10.1016/j.tsf.2005.06.005
Deposition of Ru Thin Films from Supercritical Carbon Dioxide Fluids
E. Kondoh
Japanese Journal of Applied Physics, 44, (2005), 5799.
DOI: 10.1143/JJAP.44.5799
Deposition of Cu and Ru Thin Films in Deep Nanotrenched/Holes Using Supercritical Carbon Dioxide
Eiichi Kondoh
Japanese Journal of Applied Physics, 43, (2004), 3928.
DOI: 10.1143/JJAP.43.3928
Characteristics of copper deposition in a supercritical CO2 fluid
E. Kondoh, H. Kato
Microelectronic Engineering, 64, (2002), 495−499.
DOI: 10.1016/S0167-9317(02)00826-2