国際会議発表
2015 2014 2013 2012 2011
2015年
Low Temperature Interdiffusion of Cu/Ni in Supercritical Fluid Carbon Dioxide Using a New Cu(I) Amidinate Precursor
Md Rasadujjaman, Mitsuhiro Watanabe, Hiroshi Sudoh, Hideaki Machida, Eiichi Kondoh
2015 Materials Research Society (MRS) Spring Meeting & Exhibit, San Francisco, USA, April 6−10, 2015.
Thermal etching of metal thin films using supercritical fluid
Mitsuhiro Watanabe, Yoshiki Nakamura, Eiichi Kondoh, Mikhail R. Baklanov
Plasma Etch and Strip in Microtechnology 2015 (PESM2015), Leuven, Belgium, April 27−28, 2015.
In-situ ellipsometry of Cu surfaces immersed in BTA-H2O2 solutions
Eiichi Kondoh, Tatsuya Kawakami, Mitsuhiro Watanabe, Satomi Hamada, Shohei Shima, Hirokuni Hiyama
Advanced Metallization Conference 2015: 25th Asian Session (ADMETAPlus2015), Seoul, Korea, September 16−18, 2015.
Versatility of ZnO as a room-temperature adhesion promoter for Cu/glass stacks
Mitsuhiro Watanabe, Shigeaki Tamekuni, Koumi Koike, Eiichi Kondoh
Advanced Metallization Conference 2015: 25th Asian Session (ADMETAPlus2015), Seoul, Korea, September 16−18, 2015.
Copper Thin Film Growth using Cu(I) Amidinate Precursor in Supercritical Carbon Dioxide: Deposition Kinetics and Narrow-Gap-Filling
Md Rasadujjaman, Mitsuhiro Watanabe, Hiroshi Sudoh, Hideaki Machida, Eiichi Kondoh
Advanced Metallization Conference 2015: 25th Asian Session (ADMETAPlus2015), Seoul, Korea, September 16−18, 2015.
Supercritical CO2 etching of metal thin films for magnetoresistive memory processing
Md Rasadujjaman, Yoshiki Nakamura, Mitsuhiro Watanabe, Eiichi Kondoh, Mikhail R. Baklanov
41st International Conference on Micro and Nano Engineering (MNE2015), Hague, Netherlands, September 21−24, 2015.
Ellipsometric measurement of particle-spiked wafer surfaces
Eiichi Kondoh, Hayato Kotagiri, Mitsuhiro Watanabe, Satomi Hamada, Shohei Shima, Hirokuni Hiyama
2015 International Conference on Planarization/CMP Technology (2015ICPT), Chandler, USA, September 30−Oct. 2, 2015.
2014年
Interfacial reaction in Cu/noble metal/Zn-doped glass stacks
Mitsuhiro Watanabe, Akira Teraoka, Eiichi Kondoh
Materials for Advanced Metallization 2014 (MAM2014), Chemnitz, Germany, March 2−5, 2014.
Deposition of Cu in Ru-lined Deep Nanotrenches using a New Cu(I) Amidinate Precursor
Md Rasadujjaman, Mitsuhiro Watanabe, Hiroshi Sudoh, Hideaki Machida, Eiichi Kondoh
Materials for Advanced Metallization 2014 (MAM2014), Chemnitz, Germany, March 2−5, 2014.
Reliable glass metallization for 3D MEMS with using supercritical fluids
Mitsuhiro Watanabe, Shigeaki Tamekuni, Eiichi Kondoh
40th International Conference on Micro and Nano Engineering (MNE2014), Lausannne, Switzerland, September 22−26, 2014.
Preparation of membrane-embedded nanocatalysts for fabricating long carbon nanotubes
Mitsuhiro Watanabe, Kazuma Osada, Eiichi Kondoh, Soichiro Okubo, Takeshi Hikata, Akira Nakayama
40th International Conference on Micro and Nano Engineering (MNE2014), Lausannne, Switzerland, September 22−26, 2014.
Low temperature interdiffusion of Cu/Ni thin film in supercritical carbon dioxide
Md Rasadujjaman, Mitsuhiro Watanabe, Hiroshi Sudoh, Hideaki Machida, Eiichi Kondoh
40th International Conference on Micro and Nano Engineering (MNE2014), Lausannne, Switzerland, September 22−26, 2014.
Slime mold as a smart interconnect
Eiichi Kondoh, Hiroki Yamaguchi, Mitsuhiro Watanabe
40th International Conference on Micro and Nano Engineering (MNE2014), Lausannne, Switzerland, September 22−26, 2014.
Novel supercritical CO2 reactor for wafer-scale deposition
Eiichi Kondoh, Takahiro Ueno, Yuto Takeuchi, Mitsuhiro Watanabe, Satoshi Yamamoto, Tatsuo Suemasu
Advanced Metallization Conference 2014: 24th Asian Session (ADMETAPlus2014), Tokyo, Japan, October 22−24, 2014.
Preparation of a novel catalyst structure for continuous growth of nanocarbon fibers
Mitsuhiro Watanabe, Kazuma Osada, Eiichi Kondoh, Soichiro Okubo, Takashi Hikata, Akira Nakayama
Advanced Metallization Conference 2014: 24th Asian Session (ADMETAPlus2014), Tokyo, Japan, October 22−24, 2014.
Agglomeration and diffusion in Cu thin films under supercritical CO2 annealing
Yoshiki Nakamura, Mitsuhiro Watanabe, Eiichi Kondoh
Advanced Metallization Conference 2014: 24th Asian Session (ADMETAPlus2014), Tokyo, Japan, October 22−24, 2014.
Low Temperature Interdiffusion of Cu/Ni in Supercritical Fluid Carbon Dioxide using a New Cu(I) Amidinate Precursor
Md Rasadujjaman, Mitsuhiro Watanabe, Hiroshi Sudoh, Hideaki Machida, Eiichi Kondoh
Advanced Metallization Conference 2014: 24th Asian Session (ADMETAPlus2014), Tokyo, Japan, October 22−24, 2014.
Selective Cu fill into nanopores using supercritical carbon dioxide
Eiichi Kondoh, Yukihiro Tamegai, Mitsuhiro Watanabe, Lianhua Jin
Advanced Metallization Conference 2014: 24th Asian Session (ADMETAPlus2014), Tokyo, Japan, October 22−24, 2014.
2013年
Adhesion improvement for MEMS-use Cu/glass metallization by inserting nano-precision metallic oxide layers
Mitsuhiro Watanabe, Akira Teraoka, Eiichi Kondoh
Materials for Advanced Metallization 2013 (MAM2013), Leuven, Belgium, March 10−13, 2013.
Can bio veins be used as interconnections?
Eiichi Kondoh, Hirofumi Mochizuki, Mitsuhiro Watanabe
Materials for Advanced Metallization 2013 (MAM2013), Leuven, Belgium, March 10−13, 2013.
Adhesion strength and microstructure of Cu/Ni/OsOx/glass structure for highly reliable Cu interconnection
Mitsuhiro Watanabe, Eiichi Kondoh
2013 Materials Research Society (MRS) Spring Meeting & Exhibit, San Francisco, USA, April 1−5, 2013.
Photo-assisted metal fill to nanopores using a supercritical fluid along with in-situ spectroscopic ellipsometric observation
Eiichi Kondoh, Yukihiro Tamegai, Mitsuhiro Watanabe, Lianhua Jin
39th International Conference on Micro and Nano Engineering (MNE2013), London, England, September 16−19, 2013.
Room-temperature intermixing at Cu/SiO2 interface in reliable metallization by adopting SiO2 surface dope and noble metal catalyzation
Mitsuhiro Watanabe, Akira Teraoka, Eiichi Kondoh
Advanced Metallization Conference 2013: 23st Asian Session (ADMETAPlus2013), Tokyo, Japan, October 7−10, 2013.
Cu coating inside ultra high-aspect-ratio (>130) and bended through-hole using supercritical CO2 fluid
Mitsuhiro Watanabe, Yuto Takeuchi, Takahiro Ueno, Masahiro Matsubara, Eiichi Kondoh, Satoshi Yamamoto, Naohiro Kikukawa, Tatsuo Suemasu
Advanced Metallization Conference 2013: 23st Asian Session (ADMETAPlus2013), Tokyo, Japan, October 7−10, 2013.
Deposition of Cu-Ni Alloy Thin Films in Supercritical Carbon Dioxide Solutions
Md Rasadujjaman, Mitsuhiro Watanabe, Eiichi Kondoh
Advanced Metallization Conference 2013: 23st Asian Session (ADMETAPlus2013), Tokyo, Japan, October 7−10, 2013.
2012年
In-situ Spectroscopic Ellipsometry of Cu Deposition Process from Supercritical Fluids - Evidence for a Surface Condensation Layer Formation
Eiichi Kondoh, Takuya Sasaki, Yukihiro Tamegai, Mitsuhiro Watanabe, Lianhua Jin
The 10th International Symposium on Supercritical Fluids (ISSF2012), San Francisco, USA, May 13−16, 2012.
Conformal Copper Coating Inside High Aspect Ratio Bended Through-Holes using Supercritical Carbon Dioxide
Mitsuhiro Watanabe, Yuto Takeuchi, Takahiro Ueno, Masahiro Matsubara, Eiichi Kondoh, Satoshi Yamamoto, Naohiro Kikukawa, Tatsuo Suemasu
The 10th International Symposium on Supercritical Fluids (ISSF2012), San Francisco, USA, May 13−16, 2012.
Preparation of Carbon Supported Platinum Alloy Nanoparticles using Supercritical Carbon Dioxide
Mitsuhiro Watanabe, Tatsunori Akimoto, Eiichi Kondoh
The 10th International Symposium on Supercritical Fluids (ISSF2012), San Francisco, USA, May 13−16, 2012.
Multilayer Absorption Kinetics in Nickel Thin Film Deposition from Supercritical CO2
Kazuma Osada, Mitsuhiro Watanabe, Eiichi Kondoh
The 10th International Symposium on Supercritical Fluids (ISSF2012), San Francisco, USA, May 13−16, 2012.
ZnO adhesion layer for nanoprecision electroless-Cu/glass metallization
Akira Teraoka, Mitsuhiro Watanabe, Yoichi Nabetani, Eiichi Kondoh
Advanced Metallization Conference 2012: 22st Asian Session (ADMETAPlus2012), Tokyo, Japan, October 22−25, 2012.
2011年
In-situ spectroscopic ellipsometry of Cu deposition process from supercritical fluids -An evidence for an abnormal surface layer formation
Takuya Sasaki, Yukihiro Tamegai, Mitsuhiro Watanabe, Lianhua Jin, Eiichi Kondoh
Advanced Metallization Conference 2011: 21st Asian Session (ADMETAPlus2011), Tokyo, Japan, September 12−15, 2011.
Conformal copper coating of true 3D through-holes using supercritical carbon dioxide
Mitsuhiro Watanabe, Yuto Takeuchi, Takahiro Ueno, Masahiro Matsubara, Eiichi Kondoh, Satoshi Yamamoto, Naohiro Kikukawa, Tatsuo Suemasu
Advanced Metallization Conference 2011: 21st Asian Session (ADMETAPlus2011), Tokyo, Japan, September 12−15, 2011.
Conformal copper coating of true 3D through-holes using supercritical carbon dioxide
Mitsuhiro Watanabe, Yuto Takeuchi, Takahiro Ueno, Masahiro Matsubara, Eiichi Kondoh, Satoshi Yamamoto, Naohiro Kikukawa, Tatsuo Suemasu
28th Annual Advanced Metallization Conference 2011, San Diego, USA, October 4−6, 2011.
